Hanmi Semiconductor, with TC bonder orders2expects a rebound in quarterly performance

Hanmi Semiconductor1after experiencing an earnings shock in the quarter,2is drawing attention over whether it will enter a recovery phase in performance from the quarter. The industry views HBM4investment and TC bonder orders as variables that will affect future performance. The company continues to supply HBM-related equipment.

SangSangin Securities forecast Hanmi Semiconductor's revenue this year at7,850billion won. This forecast reflects recently concluded orders and the HBM4investment schedule. Securities firms expect orders to be fully reflected in revenue from the quarter.2The forecast reflects recently concluded orders and the HBM investment schedule.

SangSangin Securities said revenue was5,767billion won higher than the previous year by36%. The same report also presented an operating profit forecast. The report cited TC bonder orders as the basis for its revenue and profit forecasts.

Operating profit was 3,694estimated at hundred million won. The report presented the profit margin at 47%. The securities firm's estimate reflects the recent order flow.

Operating profit in the previous year was 2,514hundred million won. The report expects this year's operating profit to increase by 46% from the previous year. The same document mentioned TC bonder order status as a key factor in profit improvement.

Hanmi Semiconductor has maintained a global market share of 1place in the TC bonder sector. A TC bonder is thermal-compression equipment used in the manufacture of high-bandwidth memory (HBM). HBM is memory used in artificial intelligence accelerators in data centers.

The industry believes that HBM4 investment expansion will begin in earnest from the 2quarter. Securities firms analyzed that this will bring closer the point at which TC bonder orders are converted into revenue. The company's order backlog and the timing of revenue recognition will determine the direction of its results.