Hanmi Semiconductor and SK hynix sign a 442hundred-million-won contract…2026What the second order of the year means

Hanmi Semiconductor has newly signed a 442hundred-million-won equipment supply contract with SK hynix. This is its second order from hynix in 2026year. Even the figures contained in a single disclosure show where this year's order flow is headed.

The equipment to be delivered this time is a TC bonder. It is thermal-processing equipment that applies heat to attach memory to a substrate. The delivery deadline stated in the electronic disclosure is 2026year 9month 2day.

The amount itself is not small. Hanmi Semiconductor said the contract accounts for 7.66% of its sales this year. It stands out that this is the second order following the 1month 14day contract worth 96hundred million won. In effect, hynix has called on Hanmi Semiconductor again just two months later.

The disclosure does not state whether this equipment is used in the HBM (High Bandwidth Memory, high-speed memory made by stacking multiple chips) process. However, HBM is a key semiconductor that pairs with graphics processing units (GPUs) in AI accelerators. Considering together the fact that SK Hynix is Hanmi Semiconductor’s main customer and the trend of rising HBM demand, it is possible to get an idea of where this order came from.

The company has officially disclosed exactly three facts.

• Contract value: 442hundred million won
• Delivery deadline: 2026year 9month 2day
• Share of sales: 7.66%
• Cumulative Hynix orders this year: 2contracts (1month 96hundred million won + this order 442hundred million won)

Nowhere in the disclosure does it state whether the equipment is for the HBM process. How to view that connection is left to investors.