Samsung Electronics HBM5 mockup unveiled, next-generation AI memory debuts at Computex
Samsung Electronics 2 at Computex 2026 exhibition hall, an HBM5 physical mockup was unveiled for the first time. It said it plans to apply a next-generation thermal management technology called HPB (Heat Path Block) to HBM.5HPB (Heat Path Block), a next-generation thermal management technology.
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Samsung Electronics 2 at Computex 2026 exhibition hall, an HBM5 physical mockup was unveiled for the first time. The company introduced HBM5 as 8generation high-bandwidth memory (HBM). Song Jae-hyuk, Samsung Electronics' chief technology officer of the Device Solutions Division, presented the mockup at the venue.
According to the company's announcement, HPB (Heat Path Block), a next-generation thermal management technology, is scheduled to be applied to HBM5. The company explained that HPB is designed to distribute and dissipate heat generated in the PHY area more efficiently. The company said it had completed the implementation and verification of HPB in HBM4E.
Samsung Electronics had previously mass-produced and shipped HBM4, and had supplied samples of HBM4E. The company said it plans to apply HPB to HBM4 based on verification using HBM5E. The company said it had disclosed the continuous development progress of its HBM product lineup.
The company’s HBM5plans to begin applying HPB in earnest from. The company explained that HPB is a technology designed to address heat generation during the process of improving the performance of memory for AI. However, it did not disclose specific mass-production timing or volume plans.
In its presentation at the site, the company introduced HPB’s design concept and heat-dissipation method. The presentation materials explained that HPB has a structure that channels heat from the PHY area to the outside. The company said it would continue development and further validation.