Hanmi Semiconductor and SK hynix 442hundred-million-won HBM equipment contract

Hanmi Semiconductor has signed a 442hundred-million-won supply contract with SK hynix for thermal treatment equipment (TC bonder). The purpose of the contract is to supply equipment for HBM (high-bandwidth memory). The company disclosed the contract details in the electronic disclosure system 8 days ago.

The supply period runs from 9 month 2. The contract amount corresponds to 7.66% of the company's sales last year. The disclosure specifies the delivery period and total amount, among other details.

Previously, Hanmi Semiconductor signed a 1 month 14 contract with SK hynix worth 96 hundred million won. This contract is more than 4 times larger in value. The company said this is its second major contract this year based on disclosures, including this one.

HBM is high-bandwidth memory used together with GPUs in artificial intelligence accelerators. TC bonders are equipment used in the heat-treatment process for HBM chips. Domestic semiconductor companies, including Samsung Electronics and SK hynix, are involved in HBM production.

The disclosure document includes the total contract amount and the delivery deadline. Additional contracts or disclosures confirming completed deliveries can be checked through the Electronic Disclosure System. Investors can check the delivery schedule and when the amount will be reflected in the original disclosure.

This contract was disclosed as a case involving the supply of HBM-related equipment. Hanmi Semiconductor has continued transactions with SK hynix this year. Please check the original disclosure for detailed contract terms.